M27C512

2/22

TABLE OF CONTENTS

FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. LCC Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 5. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
System Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Programming Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
PRESTO IIB Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

ERASURE OPERATION (APPLIES FOR UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 5. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. Testing Input Output Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 8. AC Testing Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Margin Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10.Margin Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 12. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11.Programming and Verify Modes AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3/22

M27C512

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 12.FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline. . . . . . . . . . . . 16
Table 13. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data . . . . 16
Figure 13.PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Outline . . . . . . . . . . . . . . . . . . . . 17
Table 14. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . 17
Figure 14.PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . 18
Table 15. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data . . . . . . . . . . 18
Figure 15.TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Outline . . . . . . . . 19
Table 16. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Mechanical Data 19

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 17. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 18. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

M27C512

4/22

SUMMARY DESCRIPTION

The M27C512 is a 512 Kbit EPROM offered in the
two ranges UV (ultra violet erase) and OTP (one
time programmable). It is ideally suited for applica-
tions where fast turn-around and pattern experi-
mentation are important requirements and is
organized as 65536 by 8 bits.
The FDIP28W (window ceramic frit-seal package)
has transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27C512 is offered in PDIP28, PLCC32 and
TSOP28 (8 x 13.4 mm) packages.
In addition to the standard versions, the packages
are also available in Lead-free versions, in compli-
ance with JEDEC Std J-STD-020B, the ST ECO-
PACK 7191395 Specification, and the RoHS
(Restriction of Hazardous Substances) directive.

Figure 2. Logic Diagram

Table 1. Signal Names

A0-A15

Address Inputs

Q0-Q7

Data Outputs

Chip Enable

Output Enable / Program Supply

Supply Voltage

Ground

Not Connected Internally

Don't Use

AI00761B

Q0-Q7

VCC

M27C512

GVPP

VSS

A0-A15

M27C512

6/22

DEVICE OPERATION

The modes of operations of the M27C512 are list-
ed in the Operating Modes table. A single power
supply is required in the read mode. All inputs are
TTL levels except for GV

and 12V on A9 for

Electronic Signature.
Read Mode
The M27C512 has two control functions, both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
Output Enable (G) is the output control and should
be used to gate data to the output pins, indepen-
dent of device selection. Assuming that the ad-

dresses are stable, the address access time
(t

AVQV

) is equal to the delay from E to output

ELQV

). Data is available at the output after a delay

of t

GLQV

from the falling edge of G, assuming that

E has been low and the addresses have been sta-
ble for at least t

AVQV

-t

GLQV

Standby Mode
The M27C512 has a standby mode which reduces
the active current from 30mA to 100µA The
M27C512 is placed in the standby mode by apply-
ing a CMOS high signal to the E input. When in the
standby mode, the outputs are in a high imped-
ance state, independent of the GV

input.

Table 2. Operating Modes

Note: X = V

or V

, V

= 12V ± 0.5V.

Table 3. Electronic Signature

Two Line Output Control
Because EPROMs are usually used in larger
memory arrays, the product features a 2 line con-
trol function which accommodates the use of mul-
tiple memory connection. The two line control
function allows:
a.

the lowest possible memory power
dissipation,

complete assurance that output bus
contention will not occur.

For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active

when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I

, has three seg-

ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output. The associated transient voltage peaks
can be suppressed by complying with the two line
output control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor be used on every device between V

and V

. This should be a high frequency capaci-

tor of low inherent inductance and should be
placed as close to the device as possible. In addi-

Mode

Q7-Q0

Read

Data Out

Output Disable

Hi-Z

Program

Pulse

Data In

Program Inhibit

Hi-Z

Standby

Hi-Z

Electronic Signature

Codes

Identifier

Hex Data

Manufacturer's Code

20h

Device Code

3Dh

7/22

M27C512

tion, a 4.7µF bulk electrolytic capacitor should be
used between V

and V

for every eight devic-

es. The bulk capacitor should be located near the
power supply connection point.The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.

Figure 6. Programming Flowchart

Programming
When delivered (and after each erasure for UV
EPROM), all bits of the M27C512 are in the '1'
state. Data is introduced by selectively program-
ming '0's into the desired bit locations. Although
only '0's will be programmed, both '1's and '0's can
be present in the data word. The only way to
change a '0' to a '1' is by die exposure to ultraviolet
light (UV EPROM). The M27C512 is in the pro-
gramming mode when V

input is at 12.75V and

E is pulsed to V

. The data to be programmed is

applied to 8 bits in parallel to the data output pins.
The levels required for the address and data in-
puts are TTL. V

is specified to be 6.25V ±

0.25V. The M27C512 can use PRESTO IIB Pro-
gramming Algorithm that drastically reduces the
programming time (typically less than 6 seconds).

Nevertheless to achieve compatibility with all pro-
gramming equipments, PRESTO Programming
Algorithm can be used as well.
PRESTO IIB Programming Algorithm
PRESTO IIB Programming Algorithm allows the
whole array to be programmed with a guaranteed
margin, in a typical time of 6.5 seconds. This can
be achieved with STMicroelectronics M27C512
due to several design innovations described in the
M27C512 datasheet to improve programming effi-
ciency and to provide adequate margin for reliabil-
ity. Before starting the programming the internal
MARGIN MODE circuit is set in order to guarantee
that each cell is programmed with enough margin.
Then a sequence of 100µs program pulses are ap-
plied to each byte until a correct verify occurs. No
overprogram pulses are applied since the verify in
MARGIN MODE provides the necessary margin.
Program Inhibit
Programming of multiple M27C512s in parallel
with different data is also easily accomplished. Ex-
cept for E, all like inputs including GV

of the par-

allel M27C512 may be common. A TTL low level
pulse applied to a M27C512's E input, with V

12.75V, will program that M27C512. A high level E
input inhibits the other M27C512s from being pro-
grammed.
Program Verify
A verify (read) should be performed on the pro-
grammed bits to determine that they were correct-
ly programmed. The verify is accomplished with G
at V

. Data should be verified with t

ELQV

after the

falling edge of E.
Electronic Signature
The Electronic Signature (ES) mode allows the
reading out of a binary code from an EPROM that
will identify its manufacturer and type. This mode
is intended for use by programming equipment to
automatically match the device to be programmed
with its corresponding programming algorithm.
The ES mode is functional in the 25°C ± 5°C am-
bient temperature range that is required when pro-
gramming the M27C512. To activate the ES
mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the
M27C512. Two identifier bytes may then be se-
quenced from the device outputs by toggling ad-
dress line A0 from V

to V

. All other address

lines must be held at V

during Electronic Signa-

ture mode. Byte 0 (A0 = V

) represents the man-

ufacturer code and byte 1 (A0 = V

) the device

identifier code. For the STMicroelectronics
M27C512, these two identifier bytes are given in

Table 3.

and can be read-out on outputs Q7 to Q0.

AI00738B

n = 0

Last

Addr

VERIFY

E = 100

s Pulse

++n

= 25

++ Addr

VCC = 6.25V, VPP = 12.75V

FAIL

CHECK ALL BYTES

1st: VCC = 6V

2nd: VCC = 4.2V

YES

SET MARGIN MODE

RESET MARGIN MODE

M27C512

8/22

ERASURE OPERATION (APPLIES FOR UV EPROM)

The erasure characteristics of the M27C512 is
such that erasure begins when the cells are ex-
posed to light with wavelengths shorter than ap-
proximately 4000 Å. It should be noted that
sunlight and some type of fluorescent lamps have
wavelengths in the 3000-4000 Å range.
Research shows that constant exposure to room
level fluorescent lighting could erase a typical
M27C512 in about 3 years, while it would take ap-
proximately 1 week to cause erasure when ex-
posed to direct sunlight. If the M27C512 is to be
exposed to these types of lighting conditions for
extended periods of time, it is suggested that

opaque labels be put over the M27C512 window to
prevent unintentional erasure. The recommended
erasure procedure for the M27C512 is exposure to
short wave ultraviolet light which has wavelength
2537 Å. The integrated dose (i.e. UV intensity x
exposure time) for erasure should be a minimum
of 15 W-sec/cm

. The erasure time with this dos-

age is approximately 15 to 20 minutes using an ul-
traviolet lamp with 12000 µW/cm

power rating.

The M27C512 should be placed within 2.5 cm (1
inch) of the lamp tubes during the erasure. Some
lamps have a filter on their tubes which should be
removed before erasure.

9/22

M27C512

MAXIMUM RATING

Stressing the device outside the ratings listed in

Table 4.

may cause permanent damage to the de-

vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of

this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.

Table 4. Absolute Maximum Ratings

Note: 1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assermbly), the ST ECOPACK

7191395 specification,

and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.

2. Minimum DC voltage on Input or Output is 0.5V with possible undershoot to 2.0V for a period less than 20ns. Maximum DC

voltage on Output is V

+0.5V with possible overshoot to V

+2V for a period less than 20ns.

3. Depends on range.

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

(3)

40 to 125

°C

BIAS

Temperature Under Bias

50 to 125

°C

STG

Storage Temperature

65 to 150

°C

LEAD

Lead Temperature during Soldering

(note 1)

°C

(2)

Input or Output Voltage (except A9)

2 to 7

Supply Voltage

2 to 7

(2)

A9 Voltage

2 to 13.5

Program Supply Voltage

2 to 14

M27C512

10/22

DC AND AC PARAMETERS

This section summarizes the operating and mea-
surement conditions, and the DC and AC charac-
teristics of the device. The parameters in the DC
and AC Characteristic tables that follow are de-
rived from tests performed under the Measure-

ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parame-
ters.

Table 5. AC Measurement Conditions

Figure 7. Testing Input Output Waveform

Figure 8. AC Testing Load Circuit

Table 6. Capacitance

Note: 1. T

= 25°C, f = 1MHz

2. Sampled only, not 100% tested.

High Speed

Standard

Input Rise and Fall Times

10ns

20ns

Input Pulse Voltages

0 to 3V

0.4V to 2.4V

Input and Output Timing Ref. Voltages

1.5V

0.8V and 2V

AI01822

High Speed

1.5V

2.4V

Standard

0.4V

2.0V

0.8V

AI01823B

1.3V

OUT

CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance

3.3k

1N914

DEVICE

UNDER

TEST

Symbol

Parameter

Test Condition

(1,2)

Min

Max

Unit

Input Capacitance

= 0V

OUT

Output Capacitance

OUT

= 0V

11/22

M27C512

Table 7. Read Mode DC Characteristics

Note: 1. V

must be applied simultaneously with or before V

and removed simultaneously or after V

2. Maximum DC voltage on Output is V

+0.5V.

Table 8. Read Mode AC Characteristics

Note: 1. V

must be applied simultaneously with or before V

and removed simultaneously or after V

2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.

Symbol

Parameter

Test Condition

(1)

Min

Max

Unit

Input Leakage Current

±10

µA

Output Leakage Current

OUT

±10

µA

Supply Current

E = V

, G = V

OUT

= 0mA, f = 5MHz

CC1

Supply Current (Standby) TTL

E = V

CC2

Supply Current (Standby) CMOS

E > V

0.2V

100

µA

Program Current

= V

µA

Input Low Voltage

0.3

0.8

(2)

Input High Voltage

+ 1

Output Low Voltage

= 2.1mA

0.4

Output High Voltage TTL

= 1mA

3.6

Output High Voltage CMOS

= 100µA

0.7V

Symbol

Alt

Parameter

Test Condition

(1)

M27C512

Unit

-45

(3)

-60

-70

-80

Min

Max

Min

Max

Min

Max

Min

Max

AVQV

ACC

Address Valid to
Output Valid

E = V

, G = V

ELQV

Chip Enable Low to
Output Valid

G = V

GLQV

Output Enable Low
to Output Valid

E = V

EHQZ

(2)

Chip Enable High
to Output Hi-Z

G = V

GHQZ

(2)

Output Enable
High to Output Hi-Z

E = V

AXQX

Address Transition
to Output Transition

E = V

, G = V

M27C512

12/22

Table 9. Read Mode AC Characteristics

Note: 1. V

must be applied simultaneously with or before V

and removed simultaneously or after V

2. Sampled only, not 100% tested.

Figure 9. Read Mode AC Waveforms

Symbol

Alt

Parameter

Test Condition

(1)

M27C512

Unit

-90

-10

-12

-15/-20/-25

Min

Max

Min

Max

Min

Max

Min

Max

AVQV

ACC

Address Valid to
Output Valid

E = V

, G = V

100

120

150

ELQV

Chip Enable Low to
Output Valid

G = V

100

120

150

GLQV

Output Enable Low
to Output Valid

E = V

EHQZ

(2)

Chip Enable High
to Output Hi-Z

G = V

GHQZ

(2)

Output Enable
High to Output Hi-Z

E = V

AXQX

Address Transition
to Output Transition

E = V

, G = V

AI00735B

tAXQX

tEHQZ

A0-A15

Q0-Q7

tAVQV

tGHQZ

tGLQV

tELQV

VALID

Hi-Z

VALID

15/22

M27C512

Table 12. Programming Mode AC Characteristics

Note: 1. T

= 25 °C; V

= 6.25V ± 0.25V; V

= 12.75V ± 0.25V

2. V

must be applied simultaneously with or before V

and removed simultaneously or after V

3. Sampled only, not 100% tested.

Figure 11. Programming and Verify Modes AC Waveforms

Symbol

Alt

Parameter

Test Condition

(1,2)

Min

Max

Unit

AVEL

Address Valid to Chip Enable Low

µs

QVEL

Input Valid to Chip Enable Low

µs

VCHEL

VCS

High to Chip Enable Low

µs

VPHEL

OES

High to Chip Enable Low

µs

VPLVPH

PRT

Rise Time

ELEH

Chip Enable Program Pulse Width (Initial)

105

µs

EHQX

Chip Enable High to Input Transition

µs

EHVPX

OEH

Chip Enable High to V

Transition

µs

VPLEL

Low to Chip Enable Low

µs

ELQV

Chip Enable Low to Output Valid

µs

EHQZ

(3)

DFP

Chip Enable High to Output Hi-Z

130

EHAX

Chip Enable High to Address Transition

AI00737

tVPLEL

PROGRAM

DATA IN

A0-A15

GVPP

Q0-Q7

DATA OUT

tAVEL

tQVEL

tVCHEL

tVPHEL

tEHQX

tEHVPX

tELEH

tELQV

tEHAX

tEHQZ

VERIFY

VALID

VCC

M27C512

22/22

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: M27C512-70F3

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: M27C512-70F3